MCA, M Phil, Ph.D. FDPM (IIM A)
senthil@tsm.ac.in
Faculty Unique ID: 1-9569537292
Prof. Senthil has been an educator for more than 15 years, and he also has an industry experience of three years. His areas of research include ICT Applications, eTourism, Digital Sentiment Analysis, Digital Watermarking, Wavelet Transforms and Multimedia Computing. This accomplished scholar has participated in Summer Research Fellowships at IIT Delhi and at the Indian Statistical Institute, Kolkata. He is one of the few professors from TSM who has participated in numerous international conferences and workshops, in addition to national level workshops and conferences. He has published numerous papers, the latest being December 2021.
Currently, he serves as the Technology Manager at TSM in addition to teaching IT and Systems including Big Data, e-commerce, Analytics, etc.
Senthil Veerasamy & Susobhan Goswami, “Smart Tourism Intermingling with Indian Spiritual Destinations: Role of e-WoM Sentiments in marketing”,ASEAN Journal on Hospitality and Tourism, Vol. 20, No. 02, August 2022, pp. 100-116. https://doi.org/10.5614/ajht.2022.20.2.07
Senthil V & Goswami S, (2022), “Is Online Learning Better than Offline Learning?”, International Journal of Education and Development using Information and Communication Technology, Vol. 18, Issue 2, pp. 177-190
Senthil, V., & Goswami, S. (2021). Can Spiritual Tourism in India be Marketed Properly? Learnings from an Analysis of Twitter. International Journal of Religious Tourism and Pilgrimage, 9(5), 6.
Senthil, V., & Goswami, S. (2020, December). An Exploratory Study of Twitter Sentiment Analysis During COVID-19:# TravelTomorrow and# UNWTO. In International Working Conference on Transfer and Diffusion of IT (pp. 487-498). Springer, Cham.
Senthil, V. (2018). Does the more internet usage provide good academic grades?. Education and Information Technologies, 23(6), 2901-2910.
Senthil, V. (2015). Is sentiment analysis in social media influence the business growth of Tamilnadu tourism?. Bonfring International Journal of Industrial Engineering and Management Science, 5(2), 33.